Electronic component products and method of manufacturing electronic component products

ABSTRACT

A calibration and part inspection method for the inspection of ball grid array, BGA, devices. Two cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A first camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into a second camera and a second additional mirror or prism located below the bottom plane of the reticle reflects the opposite side view of the reticle pattern mask through prisms or mirrors into a second camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by the two cameras. The scene of the part can thus be triangulated and the dimensions of the BGA are determined.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of pending application Ser. No.09/351,892, filed Jul. 13, 1999, which is a continuation-in-part ofapplication Ser. No. 09/008,243, filed Jan. 16, 1998, now issued as U.S.Pat. No. 6,072,898. The application Ser. No. 09/351,892 and U.S. Pat.No. 6,072,898 are incorporated by reference herein, in their entireties,for all purposes.

NOTICE REGARDING COPYRIGHT

A portion of the disclosure of this patent document contains materialthat is subject to copyright protection. The copyright owner has noobjection to the facsimile reproduction by anyone of the patentdisclosure, as it appears in the Patent and Trademark Office patentfiles or records, but otherwise reserves all copyright rightswhatsoever.

FIELD OF THE INVENTION

This invention relates to an apparatus for three dimensional inspection,a method of manufacturing electronic components using the apparatus, andand the electronic components produced according to the method. Moreparticularly, this invention relates to three dimensional inspection ofsolder balls on ball grid arrays and solder bumps on wafer and die, andto calibration.

BACKGROUND OF THE INVENTION

Prior art three dimensional inspection systems have involved laser rangefinding technology, moire interferometry, structured light patterns ortwo cameras. The laser range finding method directs a focused laser beamonto the Ball Grid Array, BGA, and detects the reflected beam with asensor. Elements of the BGA are determined in the X, Y and Z dimensionsutilizing a triangulation method. This method requires a large number ofmeasurement samples to determine the dimensions of the BGA resulting inlonger inspection times. This method also suffers from specularreflections from the smooth surfaces of the solder balls resulting inerroneous data.

Moire interferometry utilizes the interference of light waves generatedby a diffraction grating to produce a pattern of dark contours on thesurface of the BGA. These contours are of known distance in the Zdimension from the diffraction grating. By counting the number ofcontours from one point on the BGA to another point on the BGA, thedistance in the Z dimension between the two points can be determined.This method suffers from the problem of low contrast contour linesresulting in missed counting of the number of contours and resulting inerroneous data. This method also suffers from the contour lines mergingat surfaces with steep slopes, such as the sides of the balls on theBGA, resulting in an incorrect count of the number of contours andresulting in erroneous data.

Structured light systems project precise bands of light onto the part tobe inspected. The deviation of the light band from a straight line isproportional to the distance from a reference surface. The light bandsare moved across the part, or alternately the part is moved with respectto the light bands, and successive images are acquired. The maximumdeviation of the light band indicates the maximum height of a ball. Thismethod suffers from specular reflections due to the highly focusednature of the light bands resulting in erroneous data. This methodfurther suffers from increased inspection times due to the number ofimages required.

Two camera systems utilize one camera to view the BGA device in thenormal direction to determine X and Y dimensions and the second camerato view the far edges of the balls from an angle. The two images arecombined to determine the apparent height of each ball in the Zdimension utilizing a triangulation method. This method suffers from theneed for a higher angle of view of the ball from the second cameraresulting in looking at a point significantly below the top of the ballfor BGA's having fine pitch. This method also suffers from limited depthof focus for the second camera limiting the size of BGA's that can beinspected. This system can only inspect BGA's and not other device typessuch as gullwing and J lead devices.

The prior art does not provide two separate and opposite side viewspermitting larger BGA's to be inspected or nonlinear optics to enhancethe separation between adjacent ball images in the side perspectiveview.

It is therefore a motivation of the invention to improve the accuracy ofthe measurements, the speed of the measurements, the ability to measureall sizes and pitches of BGA's and to measure other devices includinggullwing and J lead parts in a single system.

SUMMARY OF THE INVENTION

The invention provides a calibration and part inspection method andapparatus for the inspection of BGA devices. The invention includes twocameras to image a precision pattern mask with dot patterns deposited ona transparent reticle to be inspected and provides information neededfor calibration. A light source and overhead light reflective diffuserprovide illumination that enhances the outline of the ball grid array. Afirst camera images the reticle precision pattern mask from directlybelow. An additional mirror or prism located below the bottom plane ofthe reticle reflects the reticle pattern mask from a side view, throughprisms or reflective surfaces, into a second camera. A second additionalmirror or prism located below the bottom plane of the reticle reflectsthe opposite side view of the reticle pattern mask through prisms ormirrors into a second camera. By imaging more than one dot pattern, themissing state values of the system can be resolved using a trigonometricsolution. The reticle with the pattern mask is removed after calibrationand a BGA to be inspected is placed with the balls facing downward, insuch a manner as to be imaged by the two cameras. The scene of the partcan thus be triangulated and the dimensions of the BGA are determined.

The system optics are designed to focus images for all perspectiveswithout the need for an additional focusing element. The optics of theside views may incorporate a nonlinear element to stretch the image inone direction to increase the apparent spacing between adjacent ballimages allowing a lower angle of view and inspection of BGA's withclosely spaced balls.

The invention provides an apparatus for inspecting a ball grid array,wherein the apparatus is calibrated using a precision pattern mask withdot patterns deposited on a calibration transparent reticle. Theapparatus for inspecting a ball grid array comprises a means formounting the ball grid array and a means for illuminating the ball gridarray to provide an outline of the ball grid array. A first camera ispositioned to image the ball grid array to provide a first image of theball grid array. A first means for light reflection is positioned toreflect the ball grid array through a second means for light reflectioninto a second camera, wherein the second camera provides a second imageof the ball grid array. A third means for light reflection is positionedto reflect an opposite side view of the ball grid array into a fourthmeans for light reflection and into the second camera as part of thesecond image of the ball grid array. A means for image processing, suchas a computer, microprocessor or digital signal processor, processes thefirst image and second image of the ball grid array to inspect the ballgrid array.

The invention also provides a method for three dimensional inspection ofa lead on a part mounted on a reticle. The method comprises the stepsof: locating a first camera to receive an image of the lead;transmitting an image of the lead to a first frame grabber; providingfixed optical elements to obtain two side perspective views of the lead;locating a second camera to receive an image of the two side perspectiveviews of the lead; transmitting the two side perspective views of thelead to a second frame grabber; operating a processor to send a commandto the first frame grabber and second frame grabber to acquire images ofpixel values from the first camera and the second camera; and processingthe pixel values with the processor to obtain three dimensional dataabout the lead.

The invention also provides a method to inspect a ball grid array devicecomprising the steps of: locating a point on a world plane determined bya bottom view ray passing through a center of a ball on the ball gridarray device; locating a side perspective view point on the world planedetermined by a side perspective view ray intersecting a ball referencepoint on the ball and intersecting the bottom view ray at a virtualpoint where the side perspective view ray intersects the world plane atan angle determined by a reflection of the side perspective view ray offof a back surface of a prism where a value of the angle was determinedduring a calibration procedure; calculating a distance L, as adifference between a first world point, defined by an intersection ofthe bottom view ray with a Z=0 world plane, and a second world point,defined by the intersection of the side perspective view ray and the Z=0a world plane, where a value Z is defined as a distance between a thirdworld point and is related to L, as follows:tan σ₁ =Z/L ₁Z=L ₁ tan θ₁wherein Z is computed based on the angle; computing an offset E as thedifference between the virtual point defined by the intersection of thebottom view ray and the side perspective view ray and a crown of a ballat a crown point that is defined by the intersect ion of the bottom viewray with the crown of the ball, and can be calculated from a knowledgeof the angle and ideal dimensions of the ball where a final value of Zfor the ballZ _(Final) =Z−E.

The invention also provides a method for finding a location anddimensions of a ball in a ball grid array from a bottom image comprisingthe steps of: defining a region of interest in the bottom image of anexpected position of a ball where a width and a height of the region ofinterest are large enough to allow for positioning tolerances of theball grid array for inspection; imaging the ball, wherein the ball isilluminated to allow a spherical shape of the ball to present a donutshaped image, wherein the region of interest includes a perimeter of theball wherein the bottom image comprises camera pixels of highergrayscale values and where a center of the bottom image comprises camerapixels of lower grayscale value and wherein a remainder of the region ofinterest comprises camera pixels of lower grayscale values; finding anapproximate center of the ball by finding an average position of pixelshaving pixel values that are greater than a predetermined thresholdvalue; converting the region of lower grayscale pixel values to highergrayscale values using coordinates of the approximate center of theball; and finding the center of the ball.

The invention also provides a method for finding a reference point on aball in an image of a side perspective view of a ball grid arraycomprising the steps of: defining a region of interest in the image froman expected position of a ball wherein a width and a height of theregion of interest are large enough to allow for positioning tolerancesof the ball grid array; imaging the ball, wherein the ball isilluminated to allow a spherical shape of the ball to present a crescentshaped image having camera pixels of higher grayscale values, andwherein a remainder of the region of interest comprises camera pixels oflower grayscale values; computing an approximate center of the crescentshaped image by finding an average position of pixels that are greaterthan a predetermined threshold value; using coordinates of theapproximate center of the crescent; determining a camera pixel as a seedpixel representing a highest edge on a top of the crescent shaped image;and determining a subpixel location of the reference point based on thecamera pixel coordinates of the seed pixel that define coordinates of aregion of interest for the seed pixel.

Electronic components are produced according to manufacturing methodsthat provide for three dimensional inspection of the electroniccomponenets.

BRIEF DESCRIPTION OF THE DRAWINGS

To illustrate this invention, a preferred embodiment will be describedherein with reference to the accompanying drawings.

FIG. 1A shows the apparatus of the invention for system calibration.

FIGS. 1B1, 1B2, and 1B3 show an example calibration pattern and exampleimages of the calibration pattern acquired by the system.

FIG. 2A shows a flow chart of a method of the invention used forcalibration of the bottom view.

FIG. 2B shows a flow chart of a method of the invention used fordetermining the state values, and the X and Y world coordinates, of thebottom view of the system.

FIG. 2C shows a flow chart of a method of the invention used forcalibration of the side perspective views.

FIG. 2D shows a flow chart of a method of the invention used fordetermining the state values of the side perspective views of thesystem.

FIG. 2E shows the relationship of a side perspective angle to the ratioof the perspective dimensions to the non-perspective dimensions.

FIGS. 2F1 and 2F2 show a bottom view and a side perspective view ofprecision dots used in the method for determining a side perspectiveview angle.

FIG. 3A shows the apparatus of the invention for part inspection.

FIGS. 3B1, 3B2, and 3B3 show example images of a part acquired by thesystem.

FIG. 4 shows a method of the invention for the three dimensionalinspection of balls on a ball grid array.

FIGS. 5A and 5B together show a flow chart of the three dimensionalinspection method of the invention.

FIGS. 6A and 6B show an example ball of a ball grid array and associatedgeometry used in a method of the invention for determining the Zposition of the ball.

FIG. 7A shows one example of an image used in the grayscale blob methodof the invention.

FIG. 7B shows one example of an image used with the method of theinvention to perform a subpixel measurement of the ball reference point.

FIG. 8A shows a side perspective image of the calibration patternmagnified in one dimension.

FIG. 8B shows a side perspective image of the balls on a BGA, magnifiedin one dimension.

FIG. 9 shows an apparatus for presenting a BGA for inspection.

FIGS. 10A and 10B show an example ball of a ball grid array withassociated geometry as used with a method of the invention fordetermining the Z position of a ball using two side perspective views.

FIG. 11A shows the apparatus of the invention for system calibration,utilizing a single side perspective view.

FIGS. 11B1, 11B2, and 11B3 show an example calibration pattern andexample images of a calibration pattern acquired by the system,utilizing a single side perspective view, of the invention.

FIG. 12A shows the apparatus of the invention for ball inspectionutilizing a single side perspective view.

FIGS. 12B1, 12B2, and 12B3 show an example ball grid array and exampleimages of the ball grid array for three dimensional inspection,utilizing a single side perspective view.

FIG. 13 shows the apparatus of the invention for the three dimensionalinspection of ball grid array devices, gullwing devices and J leaddevices.

FIG. 14 shows the apparatus of the invention for the three dimensionalinspection of parts utilizing three cameras.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

In one embodiment of the invention, the method and apparatus disclosedherein is a method and apparatus for calibrating the system by placing apattern of calibration dots of known spacing and size on the bottomplane of a calibration reticle. From the precision dots the missingstate values of the system are determined allowing for three dimensionalinspection of balls on ball grid array devices, BGA devices or balls onwafers or balls on die. In one embodiment of the invention the systemmay also inspect gullwing and J lead devices as well as ball gridarrays.

Refer now to FIG. 1A which shows the apparatus of the inventionconfigured with a calibration reticle for use during calibration of thestate values of the system. The apparatus obtains what is known as abottom image 50 of the calibration reticle 20. To take the bottom image50 the apparatus includes a camera 10 with a lens 11 and calibrationreticle 20 with a calibration pattern 22 on the bottom surface. Thecalibration pattern 22 on the reticle 20 comprises precision dots 24.The camera 10 is located below the central part of the calibrationreticle 20 to receive an image 50 described in conjunction with FIGS.1B1, 1B2, and 1B3. In one embodiment the camera 10 comprises an imagesensor. The image sensor may be a charged coupled device array. Thecamera 10 is connected to a frame grabber board 12 to receive the image50. The frame grabber board 12 provides an image data output to aprocessor 13 to perform a two dimensional calibration as described inconjunction with FIG. 2A. The processor 13 may store an image in memory14. The apparatus of the invention obtains an image of a pair of sideperspective views and includes using a camera 15 with a lens 16 and acalibration reticle 20. The camera 15 is located to receive an image 60,comprising a pair of side perspective views, described in conjunctionwith FIGS. 1B1, 1B2, and 1B3. Fixed optical elements 30, 32 and 38provide a first side perspective view and fixed optical elements 34, 36,38 for a second side perspective view. The fixed optical elements 30,32, 34, 36 and 38 may be mirrors or prisms. As will be appreciated bythose skilled in the art additional optical elements may beincorporated. The camera 15 is connected to a frame grabber board 17 toreceive the image 60. The frame grabber board 17 provides an image dataoutput to a processor 13 to perform a two dimensional inspection asdescribed in conjunction with FIG. 2B. The processor 13 may store animage in memory 14. In one embodiment of the invention, the apparatusmay contain a nonlinear optical element 39 to magnify the sideperspective image 60 in one dimension as shown in FIG. 8A. In anotherembodiment of the invention optical element 38 may be a nonlinearelement. The nonlinear optical elements 38 and 39 may be a curved mirroror a lens.

FIGS. 1B1, 1B2 and 1B3 show an example image 50 from camera 10 and anexample image 60 from camera 15 acquired by the system. The image 50, abottom view of dot pattern 22, shows dots 52 acquired by camera 10. Thedot pattern contains precision dots 24 of known dimensions and spacing.The precision dots 24 are located on the bottom surface of thecalibration reticle 20. The image 60 shows two side perspective views ofthe dot pattern 22. A first side perspective view in image 60 containsimages 62 of dots 24 and is obtained by the reflection of the image ofthe calibration reticle dot pattern 22 off of fixed optical elements 30,32 and 38 into camera 15. A second side perspective view in image 60contains images 66 of dots 24 and is obtained by the reflection of theimage of the calibration reticle dot pattern 22 off of fixed opticalelements 34, 36 and 38 into camera 15.

Optical element 36 is positioned to adjust the optical path length of asecond side perspective view to equal the optical path length of a firstside perspective view. Those skilled in the art will realize that anynumber of perspective views can be utilized by the invention. In oneembodiment of the invention, the maximum depth of focus of a sideperspective view includes an area of the reticle including the centerrow of dots. This allows for a fixed focus system to inspect largerparts, with one perspective view imaging half of the part and the secondperspective view imaging the other half of the part.

FIG. 2A shows a flow diagram for the calibration of the bottom view ofthe system. The method starts in step 101 by providing a transparentreticle 20 having a bottom surface containing a dot pattern 22,comprising precision dots 24 of known dimensions and spacing. The methodin step 102 provides a camera 10 located beneath the transparent reticle20 to receive an image 50. In step 103 the processor 13 sends a commandto a frame grabber 12 to acquire an image 50, comprising pixel valuesfrom the camera 10. The method then proceeds to step 104 and processesthe pixel values with a processor 13.

FIG. 2B shows a flow diagram for determining the state values of thebottom view of the system. In step 111 the method begins by finding thedots 52 in image 50, corresponding to the calibration dots 24. Theprocessor finds a dimension and position for each dot visible in image50 in subpixel values using well known grayscale methods and storesthese values in memory 14. By comparing these results to known valuesstored in memory, the processor calculates the missing state values forthe bottom calibration in steps 112 and 113. In step 112 the processor13 calculates the optical distortion of lens 11 and the camera rollangle with respect to the dot pattern 22. Step 113 calculates the pixelwidth and pixel height by comparing the subpixel data of dots 52 withthe known dimensions of the precision dot pattern 22. The pixel aspectratio is determined from the pixel width and pixel height. In step 114the processor defines the X and Y world coordinates and the Z=0 planefrom the image 50 of the precision dot pattern 22. The processor thenstores these results in memory. These results provide conversion factorsfor use during analysis to convert pixel values to world values.

FIG. 2C shows a flow diagram for the calibration of the side perspectiveviews of the system. The method starts in step 121 by providing atransparent reticle 20 having a bottom surface containing a dot pattern22, comprising precision dots 24 of known dimensions and spacing. Themethod in step 122 provides fixed optical elements 30, 32, 34, 36 and 38to reflect two perspective images of the precision dot pattern 22 intocamera 15. The method in step 123 provides a camera 15 located toreceive an image 60. In step 124 the processor 13 sends a command to aframe grabber 12 to acquire an image 60, comprising pixel values fromthe camera 15. The method then proceeds to step 125 and processes thepixel values with a processor 13.

FIG. 2D shows a flow diagram for determining the state values of theside perspective views of the system. In step 131 the method begins byfinding dots 62 in image 60, corresponding to the calibration dots 24.The processor finds a dimension and position for each dot visible,comprising the group of dots 62, in image 60 for a first sideperspective view in subpixel values and stores these values in memory14. By comparing these results to known values stored in memory, theprocessor calculates the missing state values for a side perspectiveview, comprising the group of dots 62, in steps 132 and 133. In step 132the processor 13 calculates the optical distortion of lens 16 and thecamera roll angle with respect to the dot pattern 22. In step 133 theprocessor 13 calculates the pixel width and pixel height by comparingthe subpixel data of dots 62 with the known dimensions of the precisiondots 24. The pixel aspect ratio is determined from the pixel width andpixel height. In step 134 the processor defines the X and Y worldcoordinates and the Z=0 plane from the dots 62 in image 60 of the dotpattern 22. The processor then stores these results in memory. Theseresults provide conversion factors for use during analysis to convertpixel values to world values. In step 135 the method of the inventioncomputes the side view angle. In step 136 the method is repeated for asecond side perspective view using the dots 66 in image 60.

FIG. 2E shows the relationship of a side perspective angle to the ratioof the perspective dimension to the non-perspective dimension. Ray 171,172, and 173 defining point 181 is parallel to ray 174, 175 and 176defining point 182. Point 181 and point 182 lie on a plane 170 parallelto a plane 180. The intersection of ray 175 and ray 176 define point186. The intersection of ray 176 and ray 172 define point 184. Theintersection of ray 173 and ray 172 define point 187. The intersectionof ray 174 and ray 172 define point 183. The reflecting plane 179intersecting plane 180 at an angle D is defined by ray 172 and ray 175and the law of reflectance. Ray 172 and ray 175 intersect plane 170 atan angle 177. Referring to FIG. 2E it can be shown:tan θ=C/D _(B)C/sin A=L/sin A Therefore: C=Lcos θ=D _(S) /L=D _(S) /CC=D _(S)/cos θSubstituting:tan θ=(D _(S)/cos θ)/D _(B) =D _(S) /D _(B) cos θ(tan θ)(cos θ)=D _(S) /D _(B)=sin θθ=arcsin(D _(S) /D _(B))

FIGS. 2F1 and 2F2 show a bottom view and a side perspective view ofprecision dots used in the method for determining a side perspectiveview angle 177 as shown in FIG. 2E of the system. A bottom view image200 comprising precision dots 201, 202 and 203 of known spacing anddimensions from the calibration method described earlier can be used toprovide a reference for determination of a side perspective view angle177. The value D_(H) and D_(B) are known from the bottom viewcalibration. A side perspective view image 210 comprising precision dots211, 212 and 213, corresponding to bottom view dots 201, 202 and 203respectively, of known spacing and dimensions D_(s) and D_(h) from thecalibration method described earlier, can be used to determine the sideview perspective angle. The ratio of (D_(h)/D_(H)) from the bottom image200 and the side perspective image 210 can be used in the bottom view tocalibrate DB in the same units as the side perspective view as follows:D _(Bcal) =D _(B)(D _(h) /D _(H))Substituting into the equation for the side perspective view angle 177described earlier yields:θ=arcsin(D _(S) /D _(B))=arcsin(D _(S) /D _(Bcal))θ=arcsin(D _(S) D _(H) /D _(B) D _(h))

FIG. 3A shows the apparatus of the invention for a three dimensionalinspection of the balls of a ball grid array. The apparatus of theinvention includes a part 70 to be inspected. The apparatus furtherincludes a camera 10 with a lens 11, located below the central area ofpart 70, to receive a bottom image 80, described in conjunction withFIGS. 3B1, 3B2, and 3B3, of part 70. The camera 10 is connected to aframe grabber board 12 to receive the image 80. The frame grabber board12 provides an image data output to a processor 13 to perform a twodimensional inspection as described in conjunction with FIG. 3A. Theprocessor 13 may store an image in memory 14. The apparatus of theinvention obtains an image of a pair of side perspective views with acamera 15 and a lens 16. The camera 15 is located to receive an image90, comprising a pair of side perspective views, described inconjunction with FIGS. 3B1, 3B2, and 3B3 and utilizing fixed opticalelements 30, 32 and 38 for a first side perspective view and fixedoptical elements 34, 36 and 38 for a second side perspective view. Inone embodiment of the invention, the apparatus may contain a nonlinearoptical element 39 to magnify the side perspective image 60 in onedimension as shown in FIG. 8B. In another embodiment of the inventionoptical element 38 may be the nonlinear element. The fixed opticalelements 30, 32, 34, 36 and 38 may be mirrors or prisms. As will beappreciated by those skilled in the art additional optical elements maybe incorporated without deviating from the spirit and scope of theinvention. The camera 15 is connected to a frame grabber board 17 toreceive the image 90. The frame grabber board 17 provides an image dataoutput to a processor 13 to calculate the Z position of the balls,described in conjunction with FIG. 32. The processor 13 may store animage in memory 14.

FIGS. 3B1, 3B2, and 3B3 show an example image 80 from camera 10 and anexample image 90 from camera 15 acquired by the system. The image 80shows the bottom view of the balls located on the bottom surface of apart 70. The image 90 shows two side view perspectives of the ballslocated on part 70. A first side perspective view in image 90 containsimages of balls 91 and is obtained by the reflection of the image of thepart 70 off of fixed optical elements 30, 32 and 38 into camera 15. Asecond side perspective view in image 90 contains images of balls 92 andis obtained by the reflection of the image of the part 70 off of fixedoptical elements 34, 36 and 38 into camera 15. Optical element 36 ispositioned to adjust the optical path length of a second sideperspective view to equal the optical path length of a first sideperspective view. In one embodiment of the invention, the maximum depthof focus of a side perspective view just includes an area of the partincluding the center row of balls. This allows for a fixed focus systemto inspect larger parts, with one perspective view imaging at least halfof the part and the second perspective view imaging at least the otherhalf of the part. Those skilled in the art will realize that any numberof perspective views can be utilized by the invention. In anotherembodiment of the invention, all of the balls are in focus from bothside perspective views resulting in two perspective views for each ball.This permits two Z calculations for each ball as shown in conjunctionwith FIGS. 10A and 10B.

FIG. 4 shows a flow diagram for the three dimensional inspection ofballs on a ball grid array. The method starts in step 141 by providing apart 70 having balls 71 facing down. The method in step 142 provides acamera 10 located beneath the part 70 to receive an image 80. In step143 a frame grabber 12 is provided to receive the image 80 from camera10. In step 144, fixed optical elements are provided for obtaining twoside perspective views of the part 70. A first optical path is providedby optical elements 30, 32 and 38. A second optical path is provided byoptical elements 34, 36 and 38. A second camera 15 receives an image 90of two side perspective views in step 145. In step 146 a second framegrabber board 17 is provided to receive the image 90 from camera 15. Aprocessor 13 sends a command to frame grabbers 12 and 17 to acquireimages 80 and 90 comprising pixel values from cameras 10 and 15. Themethod then proceeds to step 147 and processes the pixel values with aprocessor 13 to obtain three dimensional data about part 70.

The invention contemplates the inspection of parts that have ball shapedleads whether or not packaged as a ball grid array. The invention alsocontemplates inspection of leads that present a generally curvilinearprofile to an image sensor.

FIGS. 5A and 5B together show a flow chart of the three dimensionalinspection method of the invention. The process begins in step 151 bywaiting for an inspection signal. When the signal changes state, thesystem initiates the inspection. The processor 13 sends a command toframe grabber boards 12 and 17 to acquire images 80 and 90 respectivelyof part 70 having balls 71. In step 152, camera 10 captures an image 80comprising pixel values and camera 15 captures an image 90 comprisingpixel values and the processor stores the images in memory 14. Theimages comprise information from both a bottom view and two sideperspective views as shown in FIGS. 3B1, 3B2, and 3B3. In step 153, theinspection system sends a signal to a part handler shown in FIG. 9 toallow the part handler to move the part out of the inspection area andallows the next part to be moved into the inspection area. The handiermay proceed with part placement while the inspection system processesthe stored image data.

The inspection system processes the pixel values of the stored image 80in step 154 to find a rotation, and X placement and Y placement of thepart relative to the world X and Y coordinates. The processor determinesthese placement values finding points on four sides of the body of thepart. In step 155, the processor employs a part definition file thatcontains values for an ideal part.

By using the measurement values from the part definition file and theplacement values determined in step 154, the processor calculates anexpected position for each ball of the part for the bottom viewcontained in image 80.

The processor employs a search procedure on the image data to locate theballs 81 in image 80. The processor then determines each ball's centerlocation and diameter in pixel values using grayscale blob techniques asdescribed in FIG. 7A. The results are stored in memory 14.

The processor proceeds in step 156 to calculate an expected position ofthe center of each ball in both side perspective views in image 90 usingthe known position of each side view from calibration. The processoremploys a subpixel edge detection method described in FIG. 72 to locatea reference point on each ball in step 157. The results are stored inmemory 14.

Now refer to FIG. 5B. In step 158 the processor converts the storedpixel values from steps 154 and 157 into world locations by using pixelvalues and parameters determined during calibration. The world locationsrepresent physical locations of the balls with respect to the worldcoordinates defined during calibration.

In step 159 the Z height of each ball is calculated in world coordinatesin pixel values. The method proceeds by combining the location of thecenter of a ball from the bottom view 80 with the reference point of thesame ball from a side perspective view in image 90 as described in FIGS.6A and 6B. The processor then converts the world values to part valuesusing the calculated part rotation, and X placement and Y placement instep 160 to define part coordinates for the ideal part. The part valuesrepresent physical dimensions of the balls such as ball diameter, ballcenter location in X part and Y part coordinates and ball height in Zworld coordinates.

In step 161 these part values are compared to the ideal values definedin the part file to calculate the deviation of each ball center from itsideal location. In one example embodiment of the invention the deviationvalues may include ball diameter in several orientations with respect tothe X and Y part coordinates, ball center in the X direction, Ydirection and radial direction, ball pitch in the X direction and Ydirection and missing and deformed balls. The Z world data can be usedto define a seating plane, using well known mathematical formulas, fromwhich the Z dimension of the balls with respect to the seating plane canbe calculated. Those skilled in the art will recognize that there areseveral possible definitions for seating planes from the data that maybe used without deviating from the spirit and scope of the invention.

In step 162 the results of step 161 are compared to predeterminedthresholds with respect to the ideal part as defined in the part file toprovide an electronic ball inspection result. In one embodiment thepredetermined tolerance values include pass tolerance values and failtolerance values from industry standards. If the measurement values areless than or equal to the pass tolerance values, the processor assigns apass result for the part. If the measurement values exceed the failtolerance values, the processor assigns a fail result for the part. Ifthe measurement values are greater than the pass tolerance values, butless than or not equal to the fail tolerance values, the processordesignates the part to be reworked. The processor reports the inspectionresult for the part in step 163, completing part inspection. The processthen returns to step 151 to await the next inspection signal.

FIGS. 6A and 6B show an example ball of a ball grid array and associatedgeometry used in a method of the invention for determining the Zposition of the ball. The method determines the Z position of a ballwith respect to the world coordinates defined during calibration. Usingparameters determined from the calibration procedure as shown in FIGS.2B and 2D to define a world coordinate system for the bottom view andthe two side perspective views, comprising world coordinate plane 250with world coordinate origin 251 and world coordinate axis X 252, Y 253and Z 254 shown in FIG. 6A, and a pair of images 80 and 90 as shown inFIGS. 3B1, 3B2, and 3B3, the processor computes a three dimensionallocation.

Now refer to FIG. 6A. The processor locates a point 258 on the worldplane 250 determined by a bottom view ray 255 passing through the center257 of a ball 71 on a part 70. The processor locates a side perspectiveview point 260 on the world plane 250 determined by a side perspectiveview ray 256 intersecting a ball reference point 259 on ball 71 andintersecting the bottom view ray 255 at a virtual point 261. Ray 256intersects the world plane 250 at an angle 262 determined by thereflection of ray 256 off of the back surface 263 of prism 30. The valueof angle 262 was determined during the calibration procedure.

Now refer to FIG. 6B. The distance L.sub.1 is calculated by theprocessor as the difference between world point 258, defined by theintersection of ray 255 with the Z=0 world plane 250, and world point260, defined by the intersection of ray 256 and the Z=0 world plane 250.The value Z is defined as the distance between world point 261 and 258and is related to L₁ as follows:tan θ1=Z/L ₁Z can be computed by processor 13 since the angle 262 is known fromcalibration. The offset E 265 is the difference between the virtualpoint 261 defined by the intersection of ray 255 and ray 256 and thecrown of ball 71 at point 264, defined by the intersection of ray 255with the crown of ball 71, and can be calculated from the knowledge ofthe angle 262 and the ideal dimensions of the ball 71. The final valueof Z for ball 71 is:Z _(Final) =Z−E

FIG. 7A shows one example of an image used in the grayscale blob methodof the invention. The image processing method finds the location anddimensions of a ball 71 from a bottom image 80. From the expectedposition of a ball 71, a region of interest in image 80 is defined as(X1, Y1) by (X2,Y2). The width and height of the region of interest arelarge enough to allow for positioning tolerances of part 70 forinspection. Due to the design of the lighting for the bottom view, thespherical shape of balls 71 of part 70 present a donut shaped imagewhere the region 281, including the perimeter of the ball 71, comprisescamera pixels of higher grayscale values and where the central region282 comprises camera pixels of lower grayscale values. The remainder 283of the region of interest 280 comprises camera pixels of lower grayscalevalues.

In one embodiment of the invention the processor 13 implements imageprocessing functions written in the C programming language.

The C language function “FindBlobCenter”, as described below, is calledto find the approximate center of the ball 71 by finding the averageposition of pixels that are greater than a known threshold value. Usingthe coordinates of the approximate center of the ball 71, the region 282of lower grayscale pixel values can be converted to higher grayscalevalues by calling the C language function “FillBallCenter”, as describedbelow. The exact center of the ball 71 can be found by calling the Clanguage function “FindBallCenter” which also returns an X world and Yworld coordinate. The diameter of the ball 71 can be calculated by the Clanguage function, “Radius=sqrt(Area/3.14)”. The area used in thediameter calculation comprises the sum of pixels in region 281 and 282.

FIG. 7B shows one example of an image used with the method of theinvention to perform a subpixel measurement of the ball reference point.The method of the invention finds a reference point on a ball 71 in animage 90 of a side perspective view as shown in FIGS. 3B1, 3B2, and 3B3.From the expected position of a ball 71, a region of interest 290 inimage 80 is defined as (X3, Y3) by (X4, Y4). The width and height of theregion of interest are large enough to allow for positioning tolerancesof part 70 for inspection. Due to the design of the lighting for a sideperspective view, the spherical shape of balls 71 of part 70 present acrescent shaped image 291 comprising camera pixels of higher grayscalevalues and where the remainder 293 of the region of interest 290comprises camera pixels of lower grayscale values.

The C language function “FindBlobCenter” is called to compute theapproximate center of the crescent image 291 by finding the averageposition of pixels that are greater than a known threshold value. Usingthe coordinates of the approximate center of the crescent image 291, theC language function “FindCrescentTop” is called to determine the camerapixel, or seed pixel 292 representing the highest edge on the top of thecrescent. The camera pixel coordinates of the seed pixel are used as thecoordinates of a region of interest for determining the subpixellocation of the side perspective ball reference point.

One example of grayscale blob analysis and reference point determinationimplemented in the C language is presented as follows://////////////////////////////////////////////////////////// // //FindBlobCenter - finds the X,Y center of the pixels that have a valuegreater than THRESHOLD in the region (x1,y1) to (x2,y2)//////////////////////////////////////////////////////////// // longFindBlobCenter(int x1,int y1,int x2,int y2, double* pX,double* pY) { int x,y;  long Found = 0;  long SumX = 0;  long SumY = 0;  for(x=x1;x<=x2;x++)  {   for (y=y1;y<=y2;y++)   {    if (Pixel [x] [y] >THRESHOLD)    {     SumX += X;     SumY += y;     Found ++;    }   }  } if (Found > 0)  {   *pX = (double)SumX / (double)Found;   *pY =(double)SumY / (double)Found;  }  return Found; }//////////////////////////////////////////////////////////// // //FillBallCenter - fills the center of the BGA “donut”//////////////////////////////////////////////////////////// // voidFillBallCenter(double CenterX,double CenterY,double Diameter) {  intx,y;  int x1 = (int) (CenterX − Diameter / 4.0);  int x2 = (int)(CenterX + Diameter / 4.0);  int y1 = (int) (CenterY − Diameter / 4.0); int y2 = (int) (CenterY + Diameter / 4.0);  for (x=x1;x<=x2;x++)  {  for (y=y1;y<=y2;y++)   {    Pixel [x] [y] = 255;   }  } }//////////////////////////////////////////////////////////// // //FindBallCenter - finds the X,Y center of the a BGA ball //  using thegrayscale values/////////////////////////////////////////////////////////// // longFindBallCenter(int x1,int y1,int x2,int y2, double* pX,double* pY,      double* pRadius) {  int x,y;  long Found = 0;  long Total = 0; long SumX = 0;  long SumY = 0;  for (x=x1;x<=x2;++)  {   for(y=y1;y<=y2;y++)   {    if (Pixel [x] [y] > THRESHOLD)    {     SumX +=x*Pixel [x] [y];     SumY += y*Pixel [x] [y];     Total += Pixel [x][y];     Found ++;    }   }  }  if (Found > 0)  {   *pX = (double)SumX /(double)Total;   *pY = (double)SumY / (double)Total;   *pRadius =sqrt((double)Found / 3.14159279);  }  return Found; }///////////////////////////////////////////////////////////// // //FindCresentTop - finds the X,Y top position of a BGA cresent//////////////////////////////////////////////////////////// // voidFindCresentTop(int CenterX,int CenterY,int Diameter, int* pX,int* pY) { int x,y,Edge,Max,TopX,TopY;  int x1 = CenterX − Diameter / 2;  int x2 =CenterX + Diameter / 2;  int y1 = CenterY − Diameter / 2;  int y2 =CenterY;  *pY = 9999;  for (x=x1;x<=x2;x++)  {   Max = −9999;   for(y=y1;y<=y2;y++)   {    Edge = Pixel [x] [y] − Pixel [x] [y−1];    if(Edge > Max)    {     Max = Edge;     TopY = y;     TopX = x;    }   }  if (TopY < *pY)   {    *pX = TopX;    *pY = TopY;   }  } (c) 1997Scanner Technologies Inc.

FIG. 8A shows a side perspective image of the calibration patternmagnified in one dimension. FIG. 8A shows a side perspective image 300of a reticle calibration pattern where the space 303 between dot 301 anddot 302 is magnified, increasing the number of lower value grayscalepixels when compared to a non magnified image.

FIG. 8B shows a side perspective image of the balls on a BGA, magnifiedin one dimension. In FIG. 8B a side perspective image 310 of two viewsare shown where the space 313 between ball image 311 and ball image 312is magnified, increasing the number of lower value grayscale pixels whencompared to a non magnified image. The increased number of lowergrayscale value pixels allows for the successful application of thesubpixel algorithm.

In another embodiment of the invention, the method and apparatusdisclosed herein is a method and apparatus for calibrating the system byplacing a pattern of calibration dots of known spacing and dimensions onthe bottom plane of a calibration reticle and for providing for two sideperspective views of each ball for the three dimensional inspection ofparts. From the precision dots the missing state values of the systemare determined allowing for three dimensional inspection of balls on BGAdevices or balls on wafers or balls on die.

FIG. 9 shows an example apparatus for presenting a BGA to the system forinspection. An overhead light reflective diffuser 5 includes a vacuumcup assembly 6. The vacuum cup assembly may attach to a BGA part 70having balls 71 and suspend the BGA part 70 below the overhead lightreflective diffuser 5.

FIGS. 10A and 10B show an example ball on a ball grid array andassociated geometry for use with the method of the invention fordetermining the Z position of a ball with respect to the worldcoordinates defined during calibration, using two perspective views foreach ball. Using parameters determined from the calibration procedure asshown in FIGS. 2B and 2D to define a world coordinate system for thebottom view and the two side perspective views, comprising worldcoordinate plane 700 with world coordinate origin 701 and worldcoordinate axis X 702, Y 703 and Z 704 shown in FIG. 10A and FIG. 10B,and a pair of images 80 and 90 as shown in FIGS. 3B1, 3B2, and 3B3, theprocessor computes a three dimensional location.

Now refer to FIG. 10A. The processor locates a point 709 on the worldplane 700 determined by a bottom view ray 705 passing through the center708 of a ball 717. The processor locates a first side perspective viewpoint 711 on the world plane 700 determined by a side view ray 706intersecting a ball reference point 710 on ball 717 and intersecting thebottom view ray 705 at a virtual point 714. Ray 706 intersects the worldplane 700 at an angle 715 determined by the reflection of ray 706 off ofthe back surface of prism 30. The value of angle 715 was determinedduring the calibration procedure. The processor locates a second sideperspective view point 713 on the world plane 700 determined by a sideview ray 707 intersecting a ball reference point 712 on ball 717 andintersecting the bottom view ray 705 at a virtual point 718. Ray 707intersects the world plane 700 at an angle 716 determined by thereflection of ray 707 off of the back surface of prism 34. The value ofangle 716 was determined during the calibration procedure.

Now refer to FIG. 10B. The distance L₁ is calculated by the processor asthe distance between world point 709 and world point 711. The distanceL₂ is calculated by the processor as the distance between world point713 and world point 709. The value Z₁ is defined as the distance betweenworld point 714 and 709 and is related to L₁ as follows:tan θ₁ =Z ₁ /L ₁Z ₁=L₁ tan θ₁The value Z₂ is defined as the distance between world point 718 and 709and is related to L₂ as follows:tan θ₂ =Z ₂ /L ₂Z ₂ =L ₂ tan θ₂The average of Z₁ and Z₂ are calculated and used as the value for Z ofthe ball. This method is more repeatable and accurate than methods thatuse only one perspective view per ball.

In still another embodiment of the invention, the method and apparatusdisclosed herein is a method and apparatus for calibrating the system byplacing a pattern of calibration dots of known spacing and dimensions onthe bottom plane of a calibration reticle and for providing a singleside perspective view for the three dimensional inspection of parts.From the precision dots the missing state values of the system aredetermined allowing for three dimensional inspection of balls on BGAdevices or balls on wafers or balls on die.

FIG. 11A shows the apparatus of the invention for system calibration,utilizing a single side perspective view. The method and apparatus forcalibration of the bottom view is identical to the method and apparatusdescribed earlier in FIGS. 2A and 2B for the two side perspective viewsmethod. The apparatus for an image of a side perspective view includes acamera 15 with a lens 18 and a calibration reticle 20. The camera 15 islocated to receive an image 64 of a side perspective view comprisingdots 65, described in conjunction with FIGS. 11B1, 11B2, and 11B3, andutilizing fixed optical elements 40 and 42. The fixed optical element 40may be a mirror or prism. The fixed optical element 42 is a nonlinearelement that magnifies the image in one direction. In another embodimentfixed optical element 40 may be this nonlinear element. As will beappreciated by those skilled in the art additional optical elements maybe incorporated. The camera 15 is connected to a frame grabber board 17to receive the image 64. The frame grabber board 17 provides an imagedata output to a processor 13 to perform a two dimensional inspection asdescribed in conjunction with FIG. 2B. The processor 13 may store animage in memory 14.

FIGS. 11B1, 11 B2, and 11 B3 show an example calibration pattern andexample images of a calibration pattern acquired by the system,utilizing a single side perspective view, of the invention. FIGS. 11B1,11B2, and 11B3 show an example image 50 from camera 10 and an exampleimage 64 from camera 15 acquired by the system. The image 50 showingdots 52 acquired by camera 10 includes a bottom view of the dot pattern22, containing precision dots 24 of known dimensions and spacing,located on the bottom surface of the calibration reticle 20. The image64 shows a side perspective view of the dot pattern 22, containingprecision dots 24 of known dimensions and spacing, located on the bottomsurface of the calibration reticle 20. A side perspective view in image64 contains images of dots 65 and is obtained by the reflection of theimage of the calibration reticle dot pattern 22 off of fixed opticalelement 40, passing through nonlinear element 42 and into camera 15.

The side perspective calibration is identical to the method shown inFIG. 2C except the fixed optical elements may have different properties.

The determination of the state values for the side perspective view isidentical to the method shown in FIG. 2D except the fixed opticalelements may be different and there is only one side perspective view.The principles and relationships shown in FIG. 2E, FIG. 2F 1, and FIG.2F 2 apply.

In still another embodiment employing a single side perspective view,the invention does not include the nonlinear element 42.

FIG. 12A shows the apparatus of the invention for ball inspectionutilizing a single side perspective view. The apparatus of the inventionincludes a part 70 to be inspected. The apparatus further includes acamera 10 with a lens 11, located below the central area of part 70, toreceive a bottom image 80, described in conjunction with FIGS. 12B1,12B2, and 12B3, of part 70. The camera 10 is connected to a framegrabber board 12 to receive the image 80. The frame grabber board 12provides an image data output to a processor 13 to perform a twodimensional inspection as described in conjunction with FIGS. 12B1,12B2, and 12B3. The processor 13 may store an image in memory 14. Theapparatus for an image of a single side perspective view includes acamera 15 with a lens 18. The camera 15 is located to receive an image94, comprising a single side perspective view, described in conjunctionwith FIGS. 12B1, 12B2, and 12B3 and utilizing fixed optical element 40and nonlinear, fixed optical element 42, to magnify the side perspectiveview in one dimension. In another embodiment of the invention opticalelement 40 may be the nonlinear element. The fixed optical element 40may be a mirror or prism. As will be appreciated by those skilled in theart additional optical elements may be incorporated. The camera 15 isconnected to a frame grabber board 17 to receive the image 94. The framegrabber board 17 provides an image data output to a processor 13 tocalculate the Z position of the balls, described in conjunction withFIGS. 12B1, 12B2, and 12B3. The processor 13 may store an image inmemory 14.

FIGS. 12B1, 12B2, and 12B3 show an example ball grid array and exampleimages of the ball grid array for three dimensional inspection,utilizing a single side perspective view. FIGS. 12B1, 12B2, and 12B3show an example image 80 from camera 10 and an example image 94 fromcamera 15 acquired by the system. The image 80 shows the bottom view ofthe balls 71 located on the bottom surface of a part 70. The image 94shows a side perspective view of the balls 71 located on part 70. Theside perspective view in image 94 contains images of balls 95 and isobtained by the reflection of the image of the part 70 off of fixedoptical element 40 and passing through the nonlinear fixed element 42into camera 15.

In an alternate embodiment of the invention, the system can be used toinspect other types of electronic parts in three dimensions, such asgullwing and J lead devices. By utilizing only one camera and adding anadditional set of prisms on the reticle 400 these other devices may beinspected. The advantage of being able to inspect different devices withthe same system includes savings in cost, and floor space in thefactory. Additionally this design allows more flexibility in productionplanning and resource management.

FIG. 13 shows the apparatus of the invention for the three dimensionalinspection of ball grid array devices, gullwing devices and J leaddevices. The apparatus described in FIG. 13 allows the inspection ofBGA, gullwing and J lead devices all on the same system. The apparatusincludes a part 402 to be inspected located over the central area of atransparent reticle 400 with prisms 401 glued to the top surface toreceive side perspective views of part 402. A gullwing and J leadinspection device 21 may be integrated into the ball grid arrayinspection device. One example embodiment of such a gullwing and J leadinspection device is the “UltraVim” scanner from Scanner Technologies ofMinnetonka, Minn. The apparatus further includes a camera 10A with alens 11A, located below the central area of part 402 and reticle 400 toreceive a bottom view and side perspective views of part 402. The camera10A is connected to a frame grabber board 12A to receive an image. Theframe grabber board 12A provides an image data output to a processor 13Ato perform a three dimensional inspection of part 402. The processor 13Amay store an image in memory 14A. These components comprise the hardwareof the gullwing and J lead inspection device 21 and are shared by theball grid array inspection device as described herein.

The UltraVim is described in U.S. patent application Ser. No. 08/850,473entitled THREE DIMENSIONAL INSPECTION SYSTEM by Beaty et al., filed May5, 1997 which is incorporated in its entirely by reference thereto.

Refer now to FIG. 14. In still another embodiment of the invention, thesystem may use three cameras to image directly the bottom view and twoside perspective views as shown in FIG. 14. FIG. 14 shows the apparatusof the invention for a three dimensional inspection of the balls of aBGA. The apparatus of the invention includes a part 70, with balls 71 tobe inspected. The apparatus further includes a camera 10 with a lens 11,located below the central area of part 70, to receive a bottom image 80,described in conjunction with FIGS. 12B1, 12B2, and 12B3, of part 70.The camera 10 is connected to a frame grabber board 12 to receive theimage 80. The frame grabber board 12 provides an image data output to aprocessor 13 to perform a two dimensional inspection as described inconjunction with FIGS. 12B1, 12B2, and 12B3. The processor 13 may storean image in memory 14. The apparatus for an image of a first sideperspective view includes a camera 15 with a lens 19. The camera 15 islocated to receive an image 94, comprising a single side perspectiveview, described in conjunction with FIGS. 12B1, 12B2, and 12B3 andutilizing fixed optical element 38, to magnify the side perspective viewin one dimension. The camera 15 is connected to a frame grabber board 17to receive the image 94. The frame grabber board 17 provides an imagedata output to a processor 13 to calculate the Z position of the balls,described in conjunction with FIGS. 12B1, 12B2, and 12B3. The processor13 may store an image in memory 14. The apparatus for an image of asecond side perspective view includes a camera 15 with a lens 19. Thecamera 15 is located to receive an image similar to 94, comprising asingle side perspective view, described in conjunction with FIGS. 12B1,12B2, and 12B3 and utilizing fixed optical element 38, to magnify theside perspective view in one dimension. The camera 15 is connected to aframe grabber board 17 to receive the image similar to 94. The framegrabber board 17 provides an image data output to a processor 13 tocalculate the Z position of the balls, described in conjunction withFIGS. 12B1, 12B2, and 12B3. The processor 13 may store an image inmemory 14. In another embodiment, the nonlinear fixed optical element 38may be missing. In still another embodiment of the invention, only oneside perspective view may be utilized.

The invention has been described herein in considerable detail in orderto comply with the Patent Statutes and to provide those skilled in theart with the information needed to apply the novel principles and toconstruct and use such specialized components as are required. However,it is to be understood that the invention can be carried out byspecifically different equipment and devices, and that variousmodifications, both as to the equipment details and operatingprocedures, can be accomplished without departing from the scope of theinvention itself.

1. A ball array device produced according to a process comprising:combining an electronic circuit with a ball array package having aplurality of balls; making a three dimensional inspection of a lead onthe ball array package with the ball grid array device being positionedin a fixed optical system; and selecting the combination of theelectronic circuit and the ball array package as a produced ball arraydevice based upon the results of the three dimensional inspection;wherein the three dimensional inspection comprises: illuminating theball array package; taking a first image of the ball array package witha first camera disposed in a fixed focus position relative to the ballarray package to obtain a characteristic circular doughnut shape imagefrom at least one ball; taking a second image of the ball array packagewith a second camera disposed in a fixed focus position relative to theball array package to obtain a side view image of the at least one ball;and processing the first image and the second image using atriangulation method to calculate a three dimensional position of the atleast one ball with reference to a pre-calculated calibration plane. 2.The ball array device of claim 1, wherein the second image comprises asegment having a crescent shape.
 3. The ball array device of claim 1,wherein the calibration plane comprises a coordinate system having X, Yand Z axes and wherein an X measurement value is proportional to a Zmeasurement value.
 4. The ball array device of claim 1, wherein thetriangulation method to calculate a three dimensional position of the atleast one ball is based on determining a center of the ball in the firstimage and determining a ball top location in the second image.
 5. Theball array device of claim 1, wherein the pre-calculated calibrationplane is defined through measuring a calibration pattern.
 6. The ballarray device of claim 1, wherein the taking a second image furthercomprises interposing a mirror between the ball array device and thesecond camera.
 7. The ball array device of claim 1, wherein the secondimage is obtained at a low angle of view.
 8. The ball array device ofclaim 1, wherein the first camera and the second camera are fixed atdifferent angles relative to the calibration plane.
 9. The ball arraydevice of claim 1, wherein the processing measurements from the firstimage and the second image comprises employing grayscale edge detectionto locate ball positions.
 10. The ball array device of claim 1, whereinthe illuminating the ball array device comprises employing diffuseillumination.
 11. The ball array device of claim 1, wherein the ballarray devices comprise ball grid array devices.
 12. The ball arraydevice of claim 1, wherein the ball array devices comprise bump on waferdevices.
 13. The ball array device of claim 1, wherein illuminating isachieved using a single light source.
 14. The ball array device of claim1, wherein illuminating is achieved using more than one light source.15. The ball array device of claim 14, wherein the more than one lightsources used are spectrally diverse from one another.
 16. A ball arraydevice produced according to a process comprising: combining anelectronic circuit with a ball array package having a plurality ofballs; making a three dimensional inspection of a lead on the ball arraypackage with the ball grid array device being positioned in an opticalsystem; and selecting the combination of the electronic circuit and theball array package as a produced ball array device based upon theresults of the three dimensional inspection; wherein the threedimensional inspection comprises: illuminating the ball array package toproduce reflections; taking a first image of the reflections with afirst camera disposed in a first fixed position to obtain a circulardoughnut shape image of the ball array package; taking a second image ofthe reflections with a second camera disposed in a second fixed positionnon-parallel to the first fixed position to obtain a side view of theball array package; and processing measurements from the first image andthe second image to calculate a three dimensional position of at leastone ball using a triangulation method with reference to a pre-calculatedcalibration plane.
 17. The ball array device of claim 16, wherein thesecond image comprises a segment having a crescent shape.
 18. The ballarray device of claim 16, wherein the calibration plane comprises acoordinate system having X, Y and Z axes and wherein an X measurementvalue is proportional to a Z measurement value.
 19. The ball arraydevice of claim 16, wherein the pre-calculated calibration plane isdefined through measuring a calibration pattern.
 20. The ball arraydevice of claim 16, wherein the taking a second image further comprisesinterposing a mirror between the ball array device and the secondcamera.
 21. The ball array device of claim 16, wherein the processingmeasurements from the first image and the second image comprisesemploying grayscale edge detection to locate ball positions.
 22. Theball array device of claim 16, wherein the processing measurements fromthe first image and the second image comprises employing grayscale edgedetection to locate ball positions.
 23. The ball array device of claim16, wherein the illuminating the ball array device comprises employingdiffuse illumination.
 24. The ball array device of claim 16, wherein theball array devices comprise ball grid array devices.
 25. The ball arraydevice of claim 16, wherein the ball array devices comprise bump onwafer devices.
 26. The ball array device of claim 16, whereinilluminating is achieved using a single light source.
 27. The ball arraydevice of claim 16, wherein illuminating is achieved using more than onelight source.
 28. The ball array device of claim 27, wherein the morethan one light sources used are spectrally diverse from one another. 29.A ball array device produced according to a process comprising:combining an electronic circuit with a ball array package having aplurality of balls; making a three dimensional inspection of a lead onthe ball array package with the ball grid array device being positionedin an optical system; and selecting the combination of the electroniccircuit and the ball array package as a produced ball array device basedupon the results of the three dimensional inspection; wherein the threedimensional inspection comprises: illuminating the ball array package;taking a first image of the ball array package with a first cameradisposed in a first fixed position relative to the ball array package toobtain a circular doughnut shape view of the ball array package, whereinthe first camera includes a charged coupled device array; taking asecond image of the ball array package with a second camera disposed ina second fixed position non-parallel to the first fixed position toobtain a side view of the ball array package, wherein a fixed mirror isinterposed to reflect light between the ball array package and thesecond camera, and wherein the second camera includes a charged coupleddevice array; and processing measurements from the first image and thesecond image to calculate a three dimensional position of at least oneball using a triangulation method with reference to a pre-calculatedcalibration plane, wherein the calibration plane comprises a coordinatesystem having X, Y and Z axes, and wherein an X measurement value isproportional to a Z measurement value.
 30. The ball array device ofclaim 29, wherein the second image comprises a segment having a crescentshape.
 31. The ball array device of claim 29, wherein the pre-calculatedcalibration plane is defined through measuring a calibration pattern.32. The ball array device of claim 29, wherein the processingmeasurements from the first image and the second image comprisesemploying grayscale edge detection to locate ball positions.
 33. Theball array device of claim 29, wherein the illuminating the ball arraydevice comprises employing diffuse illumination.
 34. The ball arraydevice of claim 29, wherein the ball array devices comprise ball gridarray devices.
 35. The ball array device of claim 29, wherein the ballarray devices comprise bump on wafer devices.
 36. A method ofmanufacturing a ball array device, the method comprising: combining anelectronic circuit with a ball array package having a plurality ofballs; making a three dimensional inspection of a lead on the ball arraypackage with the ball grid array device being positioned in a fixedoptical system; and selecting the combination of the electronic circuitplaced inside the ball array package as a produced ball array devicebased upon the results of the three dimensional inspection; wherein thethree dimensional inspection comprises: illuminating the ball arraypackage; taking a first image of the ball array package with a firstcamera disposed in a fixed focus position relative to the ball arraypackage to obtain a characteristic circular doughnut shape image from atleast one ball; taking a second image of the ball array package with asecond camera disposed in a fixed focus position relative to the ballarray package to obtain a side view image of the at least one ball; andprocessing the first image and the second image using a triangulationmethod to calculate a three dimensional position of the at least oneball with reference to a pre-calculated calibration plane.
 37. Themethod of manufacturing of claim 36, wherein the second image comprisesa segment having a crescent shape.
 38. The method of manufacturing ofclaim 36, wherein the calibration plane comprises a coordinate systemhaving X, Y and Z axes and wherein an X measurement value isproportional to a Z measurement value.
 39. The method of manufacturingof claim 36, wherein the triangulation method to calculate a threedimensional position of the at least one ball is based on determining acenter of the ball in the first image and determining a ball toplocation in the second image.
 40. The method of manufacturing of claim36, wherein the pre-calculated calibration plane is defined throughmeasuring a calibration pattern.
 41. The method of manufacturing ofclaim 36, wherein the taking a second image further comprisesinterposing a mirror between the ball array device and the secondcamera.
 42. The method of manufacturing of claim 36, wherein the secondimage is obtained at a low angle of view.
 43. The method ofmanufacturing of claim 36, wherein the first camera and the secondcamera are fixed at different angles relative to the calibration plane.44. The method of manufacturing of claim 36, wherein the processingmeasurements from the first image and the second image comprisesemploying grayscale edge detection to locate ball positions.
 45. Themethod of manufacturing of claim 36, wherein the illuminating the ballarray device comprises employing diffuse illumination.
 46. The method ofmanufacturing of claim 36, wherein the ball array devices comprise ballgrid array devices.
 47. The method of manufacturing of claim 36, whereinthe ball array devices comprise bump on wafer devices.
 48. The method ofmanufacturing of claim 36, wherein illuminating is achieved using asingle light source.
 49. The method of manufacturing of claim 36,wherein illuminating is achieved using more than one light source. 50.The method of manufacturing of claim 49, wherein the more than one lightsources used are spectrally diverse from one another.
 51. A method ofmanufacturing a ball array device, the method comprising: combining anelectronic circuit with a ball array package having a plurality ofballs; making a three dimensional inspection of a lead on the ball arraypackage with the ball grid array device being positioned in an opticalsystem; and selecting the combination of the electronic circuit placedinside the ball array package as a produced ball array device based uponthe results of the three dimensional inspection; wherein the threedimensional inspection comprises: illuminating a ball array package toproduce reflections; taking a first image of the reflections with afirst camera disposed in a first fixed position to obtain a circulardoughnut shape image of the ball array package; taking a second image ofthe reflections with a second camera disposed in a second fixed positionnon-parallel to the first fixed position to obtain a side view of theball array package; and processing measurements from the first image andthe second image to calculate a three dimensional position of at leastone ball using a triangulation method with reference to a pre-calculatedcalibration plane.
 52. The method of manufacturing of claim 51, whereinthe second image comprises a segment having a crescent shape.
 53. Themethod of manufacturing of claim 51, wherein the calibration planecomprises a coordinate system having X, Y and Z axes and wherein an Xmeasurement value is proportional to a Z measurement value.
 54. Themethod of manufacturing of claim 51, wherein the pre-calculatedcalibration plane is defined through measuring a calibration pattern.55. The method of manufacturing of claim 51, wherein the taking a secondimage further comprises interposing a mirror between the ball arraydevice and the second camera.
 56. The method of manufacturing of claim51, wherein the processing measurements from the first image and thesecond image comprises employing grayscale edge detection to locate ballpositions.
 57. The method of manufacturing of claim 51, wherein theprocessing measurements from the first image and the second imagecomprises employing grayscale edge detection to locate ball positions.58. The method of manufacturing of claim 51, wherein the illuminatingthe ball array device comprises employing diffuse illumination.
 59. Themethod of manufacturing of claim 51, wherein the ball array devicescomprise ball grid array devices.
 60. The method of manufacturing ofclaim 51, wherein the ball array devices comprise bump on wafer devices.61. The method of manufacturing of claim 51, wherein illuminating isachieved using a single light source.
 62. The method of manufacturing ofclaim 51, wherein illuminating is achieved using more than one lightsource.
 63. The method of manufacturing of claim 62, wherein the morethan one light sources used are spectrally diverse from one another. 64.A method of manufacturing a ball array device, the method comprising:combining an electronic circuit with a ball array package having aplurality of balls; making a three dimensional inspection of a lead onthe ball array package with the ball grid array device being positionedin an optical system; and selecting the combination of the electroniccircuit placed inside the ball array package as a produced ball arraydevice based upon the results of the three dimensional inspection;wherein the three dimensional inspection comprises: illuminating a ballarray package; taking a first image of the ball array package with afirst camera disposed in a first fixed position relative to the ballarray package to obtain a circular doughnut shape view of the ball arraypackage, wherein the first camera includes a charged coupled devicearray; taking a second image of the ball array device with a secondcamera disposed in a second fixed position non-parallel to the firstfixed position to obtain a side view of the ball array package, whereina fixed mirror is interposed to reflect light between the ball arraypackage and the second camera, and wherein the second camera includes acharged coupled device array; and processing measurements from the firstimage and the second image to calculate a three dimensional position ofat least one ball using a triangulation method with reference to apre-calculated calibration plane, wherein the calibration planecomprises a coordinate system having X, Y and Z axes, and wherein an Xmeasurement value is proportional to a Z measurement value.
 65. Themethod of manufacturing of claim 64, wherein the second image comprisesa segment having a crescent shape.
 66. The method of manufacturing ofclaim 64, wherein the pre-calculated calibration plane is definedthrough measuring a calibration pattern.
 67. The method of manufacturingof claim 64, wherein the processing measurements from the first imageand the second image comprises employing grayscale edge detection tolocate ball positions.
 68. The method of manufacturing of claim 64,wherein the illuminating the ball array device comprises employingdiffuse illumination.
 69. The method of manufacturing of claim 64,wherein the ball array devices comprise ball grid array devices.
 70. Themethod of manufacturing of claim 64, wherein the ball array devicescomprise bump on wafer devices.